Will Bubbles Appear During the Injection Molding of Phone Case Mold?

The injection molding quality of phone case mold is subject to the dual constraints of mold structure design and material flow characteristics. The formation of bubbles is directly related to the physical behavior of the melt filling stage. The geometric complexity of the phone case mold cavity affects the convergence trajectory of the polymer material flow front. If gas is retained in the intersection area, a visible cavity is formed. The layout efficiency of the exhaust system determines the smoothness of the escape path of gaseous byproducts, and the depth tolerance control of the slit exhaust groove forms a dynamic balance with the gas diffusion rate.

The difference in material thermal fluidity leads to uneven volume shrinkage of the melt during the cooling process in the phone case mold, and the local negative pressure area is easy to induce the precipitation of volatile gases. The matching degree of the screw speed and the holding pressure is related to the shear heat generation scale. Excessive melt temperature may cause polymer chain segment degradation and gas production. The surface polishing grade of the phone case mold affects the fit between the melt and the cavity wall. The micro air gap formed by the micro roughness becomes the bubble nucleation point during the high-pressure filling stage.

The degree to which bubbles weaken the mechanical integrity of the product depends on the spatial distribution density of defects. Surface bubbles affect the perceived quality of the appearance, and internal cavities reduce impact resistance. The online monitoring system captures filling anomalies through ultrasonic or optical means and provides real-time feedback for process correction. Cleaning the exhaust channel residue during the maintenance cycle of the phone case mold has become a routine preventive measure to control intermittent bubble problems.