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Will Bubbles Appear During the Injection Molding of Phone Case Mold?
The injection molding quality of phone case mold is subject to the dual constraints of mold structure design and material flow characteristics. The formation of bubbles is directly related to the physical behavior of the melt filling stage.
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Hong Kong Electronic Fair Spring 2025 is coming soon. Booth Number 5G-A29
Hong Kong Electronic Fair, Spring 2025 from April 13-16. Our company will display the latest audio and plastic items including headsets, camera smart glasses, audio glasses, OWS earphone, TWS earbuds with over 15 different models.
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Hong Kong Electronic Fair 2024
Cheung Shing attended Hong Kong Electronic Fair in October 2024. We have three sale managers attended this fair. We displayed our coming up 2025 new models and products. We look forward to cooperate with brands, distribution, retailer, E-commerce and trading companies.
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